EFFECT OF ORGANIC CORROSION INHIBITOR ON COPPER PLATE CORROSION BEHAVIOR IN EMULSION

Abstract

Abstract: The polarization curves and electrochemical impedance spectra were used to study the effects of organic soluble corrosion inhibitor, thiadiazoles, on copper plate corrosion in emulsion. The morphology of copper surface and the inhibition mechanism of corrosion inhibitor were investigated by SEM and XPS techniques. The results showed that the addition of soluble corrosion inhibitor in emulsion decreases sharply the current density of corroding copper plates and enhances its inhibition efficiency significantly. It is found that the emulsion with 1.5mol/L concentration of inhibitor shows the least corrosion. The formation of Cu (I)-inhibitor chelates film on the Cu surface due to the reaction of inhibitor with Cu is the reason of not further corroding the copper plate.

Key words: copper plate, emulsion, corrosion behavior, corrosion inhibition

CLC Number:

References

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