相变散热-液冷散热耦合方法对十字形电子元件的散热效果研究

石油炼制与化工 ›› 2026, Vol. 57 ›› Issue (2): 182-189.

相变散热-液冷散热耦合方法对十字形电子元件的散热效果研究

吕超,王明,刘洋,魏宁

东北大学航空动力装备振动及控制教育部重点实验室

收稿日期:2025-08-28 修回日期:2025-10-29 出版日期:2026-02-12 发布日期:2026-01-27
通讯作者: 吕超 E-mail:lvchao@neuq.edu.cn
基金资助:
国家自然科学基金资助项目

RESEARCH ON THE HEAT DISSIPATION EFFECT OF CROSS-SHAPED ELECTRONIC COMPONENTS WITH PHASE CHANGE AND LIQUID COOLING COUPLING METHOD

Received:2025-08-28 Revised:2025-10-29 Online:2026-02-12 Published:2026-01-27

摘要/Abstract

摘要： 为提高十字形电子元件的散热效率和散热均匀性，探索研究了氧化铜（CuO）或石墨烯（GNP）纳米颗粒与石蜡复合相变材料的散热性能及纳米颗粒含量对散热效果的影响，改变冷却方式、改变冷却温度，比较其散热效果。结果表明：复合相变材料中CuO或GNP含量越高，电子元件散热效率越高；当CuO或GNP体积分数为2%时，CuO/石蜡和GNP/石蜡复合相变材料的散热效率分别比石蜡提高69.81%和157.14%。进一步，考察了相变散热与不同液冷散热方法耦合作用的散热效果，结果表明：浸没式液冷散热的散热均匀性比单壁面冷却板散热更好；对于GNP/石蜡复合相变材料-浸没式液冷耦合散热方法，石墨烯含量越高，冷却温度越低，则散热效率越高；当冷却温度从304 K降到302 K时，十字形电子元件降温幅度最大，达到0.83 K。

关键词: 复合相变材料, 相变散热, 液冷散热, 数值模拟, 凝固-熔化模型

Abstract: To improve the heat dissipation efficiency and uniformity of cross-shaped electronic components, this study investigated the thermal performance of composite phase-change materials (PCM) consisting of copper oxide (CuO) or graphene nanoplatelets (GNP) mixed with paraffin wax, as well as the effect of nanoparticle content on heat dissipation. The cooling methods and temperatures were varied to compare their cooling performance. The results show that higher CuO or GNP content in the composite PCM leads to improved heat dissipation efficiency. When the volume fraction of CuO or GNP reaches 2%, the heat dissipation efficiency of CuO/paraffin and GNP/paraffin composite PCMs increases by 69.81% and 157.14%, respectively, compared to pure paraffin.Furthermore, the study examined the cooling performance of coupled phase-change heat dissipation with different liquid cooling methods. The results indicate that immersion liquid cooling provides better heat dissipation uniformity than single-wall cooling plate methods. For the GNP/paraffin composite PCM-immersion liquid cooling coupled system, higher graphene content and lower cooling temperatures lead to improved heat dissipation efficiency. When the cooling temperature decreases from 304 K to 302 K, the cross-shaped electronic component exhibits the maximum temperature drop of 0.83 K.

Key words: composite phase change materials, phase change heat dissipation, liquid cooling heat dissipation, numerical simulation, solidification-melting model

吕超王明刘洋魏宁. 相变散热-液冷散热耦合方法对十字形电子元件的散热效果研究[J]. 石油炼制与化工, 2026, 57(2): 182-189.

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